4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Forming nonelectrolytic coating after depositing...

Masasto Takami

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Copper foil for printed circuit boards and its surface...

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Reexamination Certificate

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Method for surface treatment of copper foil

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating after depositing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2467995

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