4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Manh-Quan Tam Nguyen

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Electronic package with filled blinds vias

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Method of forming filled blind vias

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Model for modifying drill data to predict hole locations in...

Data processing: structural design – modeling – simulation – and em – Modeling by mathematical expression
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2866499

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