4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Liang Chee Tay

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Method of encapsulating thin semiconductor chip-scale packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of encapsulating thin semiconductor chip-scale packages

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Packaged microelectronic devices and methods for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2125917

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