4. Telephonic communications
  5. Echo cancellation or suppression

Lawrence Y. D. Ho

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Area array stud bump flip chip device and assembly process

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Heating arrangement for automated apparatus and method for...

Foods and beverages: apparatus – Cooking – Diverse cooker types
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Method of wet processing

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
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Off-axis optical pickup mechanism for dual-sided optical...

Dynamic information storage or retrieval – Dynamic mechanism subsystem – Access of multiple storage elements
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Spectrum-based adaptive canceller of acoustic echoes arising...

Telephonic communications – Echo cancellation or suppression
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Profile ID: LFUS-PAI-P-2020479

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