4. Semiconductor device manufacturing: process
  5. Chemical etching

Lawrence J. Charneski

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Adhesion promotion method for CVD copper metallization in IC...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion promotion method for CVD copper metallization in IC...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adhesion promotion method for electro-chemical copper...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Copper adhered to a diffusion barrier surface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Copper adhesion to a diffusion barrier surface and method for sa

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-522908

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