4. Special receptacle or package
  5. For a building component
  6. Shingle

Kurt L. Rozek

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Circuit board package and method of manufacture

Special receptacle or package – For a building component – Shingle
Patent

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Pallet and method for manufacture

Horizontally supported planar surfaces – Industrial platform – Formed from folded semirigid material
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Profile ID: LFUS-PAI-P-124851

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