4. Metal fusion bonding
  5. Process
  6. With shaping

Kris A. Slesinger

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Method and composition for mounting an electronic component...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method and composition for mounting an electronic component...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate

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Method and system for determining component dimensional...

Image analysis – Applications – Manufacturing or product inspection
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Rework and underfill nozzle for electronic components

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Reexamination Certificate

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Rework and underfill nozzle for electronic components

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2036735

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