4. Metal fusion bonding
  5. Process
  6. Applying or distributing fused filler

Kenichirou Todoroki

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Control method for copper density in a solder dipping bath

Specialized metallurgical processes – compositions for use therei – Processes – Process control responsive to sensed condition
Reexamination Certificate

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Jet solder feeding device and soldering method

Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate

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Jet solder feeding device and soldering method

Dispensing – Molten metal dispensing – Flow controllers or assists
Reexamination Certificate

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Solder jet machine and soldering method

Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate

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Soldering method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2048632

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