Keith Chistenson

Examiner

Rate now

[ 0.00 ] – not rated yet Voters 0 Comments 0

Details Keith Chistenson Keith Chistenson

: Semiconductor device manufacturing: process
: Packaging or treatment of packaged semiconductor
: Including adhesive bonding step

: Examiner
: active

Affiliated with

No affiliations

Also associated with

Using removable spacers to ensure adequate bondline thickness

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Keith Chistenson does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Keith Chistenson, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Keith Chistenson will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-P-2449337

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

Charities
Companies
MP Candidates
Patents
Employee Salary Disclosure

World

Places of the World
Scientific Papers

United States

Banks
Companies
Counties
Patents
Employee Salary Disclosure