4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Keiichi Sawai

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Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Semiconductor device having contact opening smaller than...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2728289

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