4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Joseph W. Foerstel

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Elongated bonding pad for wire bonding and sort probing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Surface mount chip carrier

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Surface mount chip carrier

Electrical connectors – Aligning means for dual inline package
Patent

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Profile ID: LFUS-PAI-P-1839220

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