4. Electric heating
  5. Metal heating
  6. By arc

Jonathon Gerrit Greenwood

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Laser defined pads for flip chip on leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Laser defined pads for flip chip on leadframe package...

Electric heating – Metal heating – By arc
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2596410

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