4. Refrigeration
  5. Structural installation
  6. With electrical component cooling

John W. Marciniec

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High-density interconnection of temperature sensitive...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Thermal mismatch compensation technique for integrated...

Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2703871

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