4. Drying and gas or vapor contact with solids
  5. Process
  6. With contacting of material treated with solid or liquid agent

John Schmittendorf

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Highly moisture-sensitive electronic device element and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Highly moisture-sensitive electronic device element and...

Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent
Reexamination Certificate

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Highly moisture-sensitive electronic device element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Highly moisture-sensitive electronic device element and...

Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent
Reexamination Certificate

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Sealing structure for highly moisture-sensitive electronic...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Profile ID: LFUS-PAI-P-2541838

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