4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Jeffrey Thomas Coffin

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EMI shielding for semiconductor chip carriers

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Method for direct attachment of a chip to a cooling member

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2487611

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