4. Semiconductor device manufacturing: process
  5. Including control responsive to sensed condition
  6. Optical characteristic sensed

Jeffrey David Birdsley

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Method for etching a flip chip using secondary particle...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate

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Semiconductor structure having backside probe points for...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Semiconductor structure with a backside protective layer and...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2023962

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