4. Compositions
  5. Electrically conductive or emissive compositions
  6. Free metal containing

Jawahar P. Nayak

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Building metal pillars in a chip for structure support

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Building metal pillars in a chip for structure support

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Conductive paste for large greensheet screening including high t

Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent

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Conductive paste for large greensheet screening including high t

Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent

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Defect reduction method for screened greensheets and article...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1509158

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