4. Communications: electrical
  5. Condition responsive indicating system
  6. Specific condition

Janice M. Danvir

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Dynamic updating of product profiles for active lifestyles

Communications: electrical – Condition responsive indicating system – Specific condition
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Flip-chip assembly with thin underfill and thick solder mask

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Heated nozzle assembly

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
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Method and apparatus to aide in emergency egress

Communications: electrical – Condition responsive indicating system – Specified indicator structure
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Monitoring for radio frequency enabled items based on...

Communications: electrical – Condition responsive indicating system – Specific condition
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Profile ID: LFUS-PAI-P-2330414

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