4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Janet L. Rice

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Integrated MEMS device and package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Packaging of MEMS devices using a thermoplastic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2595456

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