4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Hua-Wen Chiang

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method and device for making a metal bump with an increased...

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor chip package with cooling arrangement

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hua-Wen Chiang does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Hua-Wen Chiang, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hua-Wen Chiang will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2547044

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure