4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Hsuan-Jui Chang

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Method and device for making a metal bump with an increased...

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Semiconductor chip package with cooling arrangement

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2547046

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