4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough

Hsing-Jung Liau

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Microsystem package structure

Optical: systems and elements – Optical modulator – Light wave temporal modulation
Reexamination Certificate

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Wafer-level package with a cavity and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2743438

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