4. Metal fusion bonding
  5. Process
  6. Plural diverse bonding

Hiroyuki Fujihira

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Anisotropically electroconductive connection body and method...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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COG-assembly and connecting material to be used therein

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Connection structure for semiconductor electrode terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Packaging method

Metal fusion bonding – Process – Plural diverse bonding
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2521579

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