4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Hien-Tien Chiu

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MOCVD molybdenum nitride diffusion barrier for CU metallization

Organic compounds -- part of the class 532-570 series – Organic compounds – Heavy metal containing
Reexamination Certificate

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MOCVD molybdenum nitride diffusion barrier for Cu metallization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Process for fabricating tantalum nitride diffusion barrier for c

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-394319

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