4. Coating processes
  5. Electrical product produced
  6. Integrated circuit, printed circuit, or circuit board

Hideyasu Nikaido

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Lead frame for IC having a wire bonding part composed of multi-l

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Method for manufacture of aluminum-coated lead frame

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Profile ID: LFUS-PAI-P-1137504

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