4. Textiles: weaving
  5. Weft manipulation
  6. Lays or beat-ups

Hideo Shinomiya

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Dents for reed in high-speed weaving machine, and method of manu

Textiles: weaving – Weft manipulation – Lays or beat-ups
Patent

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Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1889974

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