4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Hans Hermann Oppermann

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Method of joining electronic components to a substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Process for remelting a contact surface metallization

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-322540

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