4. Metal fusion bonding
  5. Process
  6. Using bond inhibiting separating material

Gun-Yong Lee

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Method for preventing a gold plate connector on a PCB from...

Metal fusion bonding – Process – Using bond inhibiting separating material
Utility Patent

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Printed circuit board and pad apparatus having a solder deposit

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2080999

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