4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Glen W Devos

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Heat-dissipating assembly for removing heat from a flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Method for removing heat from a flip chip semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2085400

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