4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Gerald W. Swift

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Extra high frequency (EHF) circuit module

Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Patent

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Phased array with integrated bandpass filter superstructure

Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin
Patent

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Phased array with integrated bandpass filter superstructure

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Radial wave power divider/combiner and related method

Wave transmission lines and networks – Plural channel systems – Having branched circuits
Patent

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Profile ID: LFUS-PAI-P-316199

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