4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Gerald G. Advocate, Jr.

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Formation of a metallic interlocking structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Metallic interlocking structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Method of assembling an interconnect device assembly

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2528995

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