4. Metal working
  5. Method of mechanical manufacture
  6. Assembling or joining

Fritz W. Beyerlein

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Die attach pad adapted to reduce delamination stress and...

Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – On integrated circuit
Utility Patent

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Semiconductor assembly and method

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Semiconductor lead structure and assembly and method for fabrica

Metal working – Method of mechanical manufacture – Assembling or joining
Patent

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Profile ID: LFUS-PAI-P-206529

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