4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Frederic Pierre

Inventor

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Method for forming reflowed solder ball with low melting...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Plush rabbit

Design Patent

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Reflowed solder ball with low melting point metal cap

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2098723

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