4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Edward William Kiewra

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Capacitive monitors for detecting metal extrusion during...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – For fault location
Reexamination Certificate

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Dual-RIE structure for via/line interconnections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Dual-rie structure for via/line interconnections

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Isotropic silicon etch process that is highly selective to tungs

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Profile ID: LFUS-PAI-P-1755156

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