4. Etching a substrate: processes
  5. Forming groove or hole in a substrate which is subsequently...

Diane Lai

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Method of forming a through-substrate interconnect

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method of forming a through-substrate interconnect

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
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Method of forming a through-substrate interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure
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Particle tolerant architecture for feed holes and method of...

Etching a substrate: processes – Forming groove or hole in a substrate which is subsequently...
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Profile ID: LFUS-PAI-P-2724266

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