Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Inventor
active
Method for forming a copper film on a substrate
Microelectronic interconnect material with adhesion...
Microelectronic interconnect material with adhesion...
Microelectronic interconnect material with adhesion...
No associations
LandOfFree
David R. Campbell, Sr. does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with David R. Campbell, Sr., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and David R. Campbell, Sr. will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2475452