4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Dan F. Ammar

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Microwave monolithic integrated circuit package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Microwave monolithic integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Self-tuned millimeter wave RF transceiver module

Telecommunications – Transmitter and receiver at same station
Reexamination Certificate

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Self-tuned millimeter wave RF transceiver module

Telecommunications – Receiver or analog modulated signal frequency converter – Local control of receiver operation
Reexamination Certificate

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Thick film millimeter wave transceiver module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2686234

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