4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Compass Technology Co. Ltd.

Corporate Assignee

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Corporate Assignee

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Die-up integrated circuit package with grounded stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Multiple integrated circuit die package with thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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