4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Clarisay, Incorporated

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Hermetic package for surface acoustic wave device and method...

Wave transmission lines and networks – Coupling networks – Electromechanical filter
Reexamination Certificate

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System and method for dissipating static charge generated in...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Wafer-scale package for surface acoustic wave circuit and...

Wave transmission lines and networks – Coupling networks – Electromechanical filter
Reexamination Certificate

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Wafer-scale package for surface acoustic wave circuit and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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