4. Buckles, buttons, clasps, etc.
  5. Clasp, clip, support-clamp, or required component thereof
  6. Having gripping member shifted by operator

Christopher L. Felix

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Heat sink pressure clip

Buckles – buttons – clasps – etc. – Clasp – clip – support-clamp – or required component thereof – Having gripping member shifted by operator
Reexamination Certificate

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Pressure-bonded heat sink method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Pressure-bonded heat-sink system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2103558

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