4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Chien-Wei Chieh

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Packaging structure and method of an image sensor module

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Packaging structure and method of an image sensor module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3151538

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