4. Synthetic resins or natural rubbers -- part of the class 520 ser
  5. Synthetic resins
  6. Processes of preparing a desired or intentional composition...

Cheng Qiang Cui

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Die-up integrated circuit package with grounded stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Epoxy resin compositions for liquid encapsulation

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Method for lamination of fluoropolymer to metal and printed...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method for low temperature lamination of metals to polyimides

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method for low temperature lamination of metals to...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2031787

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