4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including contaminant removal or mitigation

Cathy McEleney

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Method and apparatus for sealing a chip carrier and lid

Metal fusion bonding – With means to juxtapose and bond plural workpieces
Reexamination Certificate

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Method and apparatus for sealing a chip carrier and lid

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2041632

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