4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Byron Vencent Bell

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Diffusion barrier and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Diffusion barrier and method therefor

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Heater chip configuration for an inkjet printhead and printer

Incremental printing of symbolic information – Ink jet – Ejector mechanism
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Heater chip configuration for an inkjet printhead and printer

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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Heater chip configuration for an inkjet printhead and printer

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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