4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. Flexible panel

Brian John Hayden

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Method for ultrasonic bonding flexible circuits

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Method of soldering materials supported on low-melting substrate

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Solderless flip-chip assembly and method and material for same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Substrate and electrical connector assembly

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Flexible panel
Patent

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Profile ID: LFUS-PAI-P-352007

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