4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Bradley R. Knigga

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Electronic module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method for integrated circuit packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Multilayer conductor for printed circuits

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Thick film accelerometer

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element
Patent

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Thick film rotational accelerometer having two structurally inte

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element
Patent

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Profile ID: LFUS-PAI-P-403953

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