4. Measuring and testing
  5. Specimen stress or strain, or testing by stress or strain...
  6. Specified electrical sensor or system

Aparna Vaidyanthan

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Solder bump input/output pad for a surface mount circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Strain gauge with steel substrate

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system
Patent

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Profile ID: LFUS-PAI-P-924451

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