4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Alonzo Chamblis

Examiner

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Examiner

active

No affiliations

Methods of fabrication for flip-chip image sensor packages

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor device and semiconductor device mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Alonzo Chamblis does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Alonzo Chamblis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alonzo Chamblis will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2512448

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure