4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Albert Wong Chan

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Conductive composition

Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate

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Methods for making circuit substrates and electrical assemblies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Multi-layer circuit substrates and electrical assemblies having

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-1159239

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