Corporate Assignee
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Corporate Assignee
active
No affiliations
Heat dissipating device adapted to be applied to a flip chip...
Heat dissipation device with ribbed fin plates
Heat-radiating device of chip
Radiator fin formed by sintering operation
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Profile ID: LFUS-PAI-P-2431378